Advances in Manufacturing

Guest editorial

Johan Liu Mervi Paulasto-Kro¨ckel

2013, 1(3): 197-197. doi:DOI:10.1007/s40436-013-0038-x

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Molecular and crystal assembly inside the carbon nanotube: encapsulation and manufacturing approaches

Sergio Manzetti

2013, 1(3): 198-210. doi:DOI10.1007/s40436-013-0030-5

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Encapsulation of different guest-species such as molecules and ions inside carbon nanotubes (CNTs) has been reported in the literatures during the last 15 years and represents an exciting development of nanoengineering of novel materials and composites. The reported nanocomposite materials show the semi-conducting properties with potential applications in nanosensors, nanounits and nanocircuits aswell as advanced energy transfer and storage properties, and encompassmanufacturing for novel nanowires, nanoelectronic devices with properties designed with optoelectronic, spintronic
and nanomagnetic qualities. This review reports on a wide range of encapsulation references with particular focus on single molecules, atomic chains, metal halides and polymers encapsulated inside CNTs. The encapsulationmethods and the chemical and physical qualities of these novel materials are
crucial for the future manufacturing of novel innovations in nanotechnology, and represent therefore the current state-ofthe-art of encapsulation methods in advanced manufacturing.

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

N. Strusevich M. PateM. P. Y. Desmulliez E. Abraham D. Flynn T. Jones

2013, 1(3): 211-217. doi:DOI10.1007/s40436-013-0039-9

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This paper considers the copper electrodeposit-ion processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

Local synthesis of carbon nanotubes for direct integration in Simicrosystems – design considerations

K. E. Aasmundtveit B. Q. Ta Q.-H. Nguyen T. B. Haugen N. Hoivik E. Halv

2013, 1(3): 218-225. doi:DOI10.1007/s40436-013-0037-y

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The integration of nanomaterials such as carbon nanotubes (CNTs) into microsystems is highly desirable, in order to make use of the unique nanomaterial properties in real devices. However, the CNT-to-microsystem integration is challenging to implement in a manufacturable, cost-effective industrial process. This paper presents our work towards a process for making complete, integrated CMOS /MEMS systems with integrated CNT. We demonstrate the feasibility of the process, using room-temperature process-ing, low-cost equipment and consumables, and electrical control with automation possibilities. CNTs are directly integrated at the desired positions in the Si microsystem, forming closed Si / CNT / Si circuits. We explore different designs with the aim to obtain uniform and well-defined CNT synthesis conditions, and show that simplified designs can perform comparably to more complex ones. The Si /CNT / Si circuits obtained can show rectifying (Schottky-like) or near-ohmic behavior. Gas sensing possibilities are demonstrated, indicating the possibility of monitoring aging/fermenting of food. Functionalization of CNTs is demon-strated, using thermal evaporation of Sn and Pd, opening for selective and sensitive sensors for various gases and ana-lytes. Detailed microscopic characterization of the obtained CNTs are presented.

Wafer-level SLID bonding for MEMS encapsulation

H. Xu T. Suni V. Vuorinen J. Li H. Heikkinen P. Monnoyer M. Paulasto-Kro¨ ckel

2013, 1(3): 226-235. doi:DOI10.1007/s40436-013-0035-0

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Hermetic packaging is often an essential requirement to enable proper functionality throughout the device’s lifetime and ensure the optimal performance of a
micro electronic mechanical system (MEMS) device. Solid-liquid interdiffusion (SLID) bonding is a novel and attractive way to encapsulate MEMS devices at a wafer level. SLID bonding utilizes a low-melting-point metal to reduce the bonding process temperature; and metallic seal rings take out less of the valuable surface area and have a lower gas permeability compared to polymer or glass-based sealing materials. In addition, ductile metals can adopt mechanical and thermo-mechanical stresses during their service lifetime, which improves their reliability. In this study, the principles of Au-Sn and Cu-Sn SLID
bonding are presented, which are meant to be used for wafer-level hermetic sealing of MEMS resonators. Seal rings in 15.24 cm silicon wafers were bonded at a width of 60lm, electroplated, and used with Au-Sn and Cu-Sn layer structures. The wafer bonding temperature varied between 300 C and 350 C, and the bonding force was 3.5 kN under the ambient pressure, that is, it was less than 0.1 Pa. A shear test was used to compare the mechanical properties of the interconnections between both material systems. In addition, important factors pertaining to bond ring design are discussed according to their effects on the
failure mechanisms. The results show that the design ometal structures can significantly affect the reliability of bond rings.

Effect of substrates and underlayer on CNT synthesis by plasma enhanced CVD

L. Xu S.-T. Tu D. Jiang J. Liu Y.-F. Fu S. Xavier S. Bansropun A. Ziaei

2013, 1(3): 236-240. doi:DOI10.1007/s40436-013-0036-z

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Due to their unique thermal, electronic and mechanical properties, carbon nanotubes (CNTs) have aroused various attentions of many researchers. Among all the techniques to fabricate CNTs, plasma enhanced chemical vapor deposition (PECVD) has been extensively developed as one growth technique to produce vertically-aligned car-bon nanotubes (VACNTs). Though CNTs show a trend to be integrated into nanoelectromechanical system (NEMS),CNT growth still remains a mysterious technology. This paper attempts to reveal the effects of substrates and un-derlayers to CNT synthesis. We tried five different substrates by substituting intrinsic Si with high resistivity ones and by increasing the thickness of SiO2 insulativity layer. And also,we demonstrated an innovative way of adjusting CNT den-sity by changing the thickness of Cu underlayer.

A novel approach for part family formation using K-means algorithm

Ashutosh Gupta P. K. Jain Dinesh Kumar

2013, 1(3): 241-250. doi:DOI10.1007/s40436-013-0032-3

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The reconfigurable manufacturing system (RMS) is the next step in manufacturing, allowing the production of any quantity of highly customized and complex parts together with the benefits of mass production. In RMSs, parts are grouped into families, each of which requires a specific system configuration. Initially system is configured to produce the first family of parts. Once it is finished, the system will be reconfigured in order to produce the second family, and so forth. The effectiveness of a RMS depends on the formation of the optimum set of part families addressing various recon-figurability issues. The aim of this work is to establish a methodology for grouping parts into families for effective working of RMS. The methodology carried out in two phases.In the first phase, the correlation matrix is used as similarity coefficient matrix. In the second phase, agglomerative hier-archicalK-means algorithm is used for the parts family for-mation resulting in an optimum set of part families for reconfigurable manufacturing system.

Phase precipitation and isothermal crystallization kinetics of FeZrB amorphous alloy

Bing-Ge Zhao Ling-Hong Kong Ting-Ting Song Qi-Jie Zhai Yu-Lai Gao

2013, 1(3): 251-257. doi:DOI10.1007/s40436-013-0033-2

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The crystallization process of Fe78Zr7 B15 (at%) amorphous ribbon was investigated by X-ray diffraction (XRD), differential scanning calorimetry and scanning electron microscopy (SEM). The fully amorphous structure of as-quenched (Aq) ribbons was confirmed by XRD pattern. The saturation magnetization ( M s) and Curie tem-perature of the Aq ribbon were measured as 124.3 (A m 2)/kg and 305 C with vibrating sample magnetometer (VSM), respectively. When the ribbons was annealed at 550 C near the first onset temperature (Tx1 = 564.9 C), the Ms was increased by 17 %, which was caused by the formation of a dual phase structure. The isothermal crystallization kinetics and crystallization mechanism of primary a-Fe phase in the dual phase structure were studied by Arrhenius and Johnson-Mehl-Avrami-Kolmogorov equations respectively. The results showed that the crystallization of a-Fe phase was a diffusion-controlled surface nucleation growth process,and the nucleation rate decreased with longer crystallization time.

Object recognition and pose estimation using appearance manifolds

Zhong-Hua Hao Shi-Wei Ma

2013, 1(3): 258-264. doi:DOI10.1007/s40436-013-0022-5

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Conventionally, image object recognition and pose estimation are two independent components in machine vision. This paper presented a simple but effective method KNN-SNG, which tightly couples these two com-ponents within a single algorithm framework. The basic idea of this method came from the bionic pattern recog-nition and the manifold ways of perception. Firstly, the shortest neighborhood graphs (SNG) are established for each registered object. SNG can be regarded as a covering and triangulation for a hypersurface on which the training data are distributed. Then for recognition task, the deter-mined test image lies on which SNG by employing the parameter ‘‘k ’’, which could be calculated adaptively. Finally, the local linear approximation method was adopted to build a local map between high-dimensional image space and low-dimensional manifold for pose estimation. The projective coordinates on manifold can depict the pose of object. Experiment results manifested the effectiveness of the method.

Simultaneous optimization of multiple performance characteristics in WEDM for machining ZC63/SiCp MMC

Thella Babu Rao A. Gopala Krishna

2013, 1(3): 265-275. doi:DOI10.1007/s40436-013-0029-y

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The compliance of an integrated approach, principal component analysis (PCA), coupled with Tagu-chi’s robust theory for simultaneous optimization of cor-related multiple responses of wire electrical discharge machining (WEDM) process for machining SiC Prein-forced ZC63 metal matrix composites (MMCs) is investi-gated in this work. The WEDM is proven better for its efficiency to machine MMCs among others, while the particulate size and volume percentage of SiCp with the composite are the utmost important factors. These improve the mechanical properties enormously, however reduce the machining performance. Hence the WEDM experiments are conducted by varying the particulate size, volume fraction, pulse-on time, pulse-off time and wire tension. In the view of quality cut, the most important performance indicators of WEDM as surface roughness ( Ra ), metal removal rate (MRR), wire wear ratio (WWR), kerf ( Kw ) and white layer thickness (WLT) are measured as respon-ses. PCA is used as multi-response optimization technique to derive the composite principal component (CPC) which acts as the overall quality index in the process. Consequently, Taguchi’s S/N ratio analysis is applied to optimize the CPC. The derived optimal process responses are confirmed by the experimental validation tests results. The analysis of vari-ance is conducted to find the effects of choosing process variables on the overall quality of the machined component.The practical possibility of the derived optimal process conditions is also presented using SEM.

Investigation on the application of reformed coke oven gas in direct reduction iron production with a mathematical model

Juan Wu Shu-Qiang Guo Wei-Zhong Ding

2013, 1(3): 276-283. doi:DOI10.1007/s40436-013-0031-4

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To investigate the application of reformed coke oven gas (COG) in producing the direct reduction iron (DRI), we simulated a countercurrent gas solid moving bed reactor in which the iron ore pellet was reduced by reformed COG. An ordinary differential equation (ODE) was set based on the unreacted shrinking core model considering both mass and energy balances of the reactor. The concentration and temperature profiles of all species within the reactor were obtained by solving the ODE sys-tem. The solid conversion and gas utilization were studied by changing gas flow rate, solid flow rate, reactor length, and the ratio of O/CH₄ to guide the practical application of COG in DRI production. Model results showed that COG was suitable for the DRI production. In order to meet the requirement of the industrial production, the minimum gas flow rate was set as 130,000 Nm 3/h, and the maximum production was 90 t/h. The reactor length and the mole ratio x (O): x (CH₄) were depended on the actual industrial situations.

Degree dependence entropy descriptor for complex networks

Xiang-Li Xu Xiao-Feng Hu Xiao-Yuan He

2013, 1(3): 284-287. doi:DOI10.1007/s40436-013-0034-1

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In order to supply better accordance for mod-eling and simulation of complex networks, a new degree dependence entropy (DDE) descriptor is proposed to describe the degree dependence relationship and corre-sponding characteristic in this paper. First of all, degrees of vertices and the shortest path lengths between all pairs of vertices are computed. Then the degree dependence matrices under different shortest path lengths are con-structed. At last the DDEs are extracted from the degree dependence matrices. Simulation results show that the DDE descriptor can reflect the complexity of degree dependence relationship in complex networks; high DDE indicates complex degree dependence relationship; low DDE indicates the opposite one. The DDE can be seen as a quantitative statistical characteristic, which is meaningful for networked modeling and simulation.

Bilateral teleoperation with reducing wave-based reflections

Min Zheng Qing-Hai Chen Hai-Nan Yang

2013, 1(3): 288-292. doi:DOI10.1007/s40436-013-0016-3

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This paper presents a wave-based bilateral teleoperation structure to reduce the wave reflection and enhance the force and speed tracking performance throughv adjusting the relative parameters. A time domain passive approach is also applied to deal with the passivity of whole system even with non passive environment. The efficiency of the proposed method is confirmed by some experimental results.

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