Abstract: For the typical color defects of polysilicon wafers, i.e., edge discoloration, color inaccuracy and color non-uniformity, a new integrated machine vision detection method is proposed based on an HSV color model. By transforming RGB image into three-channel HSV images, the HSV model can efficiently reduce the disturbances of complex wafer textures. A fuzzy color clustering method is used to detect edge discoloration by defining membership function for each channel image. The mean-value classifying method and region growing method are used to identify the other two defects, respectively. A vision detection system is developed and applied in the production of polysilicon wafers.

Key words: Polysilicon wafers ,  Color defect detection ,  Machine vision ,  Fuzzy color clustering ,  Region growing method