For the typical color defects of polysilicon
wafers, i.e., edge discoloration, color inaccuracy and color
non-uniformity, a new integrated machine vision detection
method is proposed based on an HSV color model. By
transforming RGB image into three-channel HSV images,
the HSV model can efficiently reduce the disturbances of
complex wafer textures. A fuzzy color clustering method is
used to detect edge discoloration by defining membership
function for each channel image. The mean-value classifying
method and region growing method are used to
identify the other two defects, respectively. A vision
detection system is developed and applied in the production
of polysilicon wafers.
Zai-Fang Zhang
,
Yuan Liu
,
Xiao-Song Wu
,
Shu-Lin Kan
. Integrated color defect detection method for polysilicon wafers
using machine vision[J]. Advances in Manufacturing, 2014
, 2(4)
: 318
-326
.
DOI: 10.1007/s40436-014-0095-9
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