ARTICLES

Microstructures and properties evolution of Al-Zn-Mg-Cu alloy under electrical pulse assisted creep aging

  • Tian-Jun Bian ,
  • Heng Li ,
  • Chao Lei ,
  • Chang-Hui Wu ,
  • Li-Wen Zhang
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  • 1. State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an, 710072, People's Republic of China;
    2. School of Materials Science and Engineering, Xi'an University of Technology, Xi'an, 710048, People's Republic of China

Received date: 2021-12-28

  Revised date: 2022-02-23

  Online published: 2022-11-05

Supported by

The research is supported by the Natural Science Foundation of China (Grant Nos. 51905424, 51522509, 51235010).

Abstract

Creep aging (CA) is a promising forming technology for integral panels with complex structures. However, how to balance excellent corrosion resistance and strength is still a challenge for CA parts. By synchronously applying electrical pulse (300 Hz, 15 A/mm2) in the middle of steady-state CA of Al-Zn-Mg-Cu alloy, the electrically assisted CA (ECA) is proposed to induce retrogression rapidly for realizing a three-step aging (retrogression and re-aging, RRA) in CA to tailor the needed properties balance. It is compared with conventional CA with one-step aging (peak aging, T6 or over aging, T7), two-step aging (over aging, T73) and RRA in hardness, intergranular corrosion and microstructures. For the ECA of pre-aging and re-aging for 20 h plus electropulsing for 10 min, the hardness is 10.5%, 20.5% and 18.9% higher than those of CA with T6, T7 and T73 processes, respectively, while the corrosion resistance is higher than T6 process and lower than T7 and T73 processes. Although the hardness and corrosion resistance are comparable to those of the CA with the RRA process, ECA takes one hour less due to the accelerated effect of the electropulsing and is not limited by the thick plates. The improved comprehensive performance of the ECA sample is due to both fine intragranular precipitates η′ and large discontinuous grain boundary precipitates η.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00404-2

Cite this article

Tian-Jun Bian , Heng Li , Chao Lei , Chang-Hui Wu , Li-Wen Zhang . Microstructures and properties evolution of Al-Zn-Mg-Cu alloy under electrical pulse assisted creep aging[J]. Advances in Manufacturing, 2022 , 10(4) : 596 -609 . DOI: 10.1007/s40436-022-00404-2

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