Marble is a typical hard and brittle material, widely used in construction, home decoration, and other fields due to its high strength, hardness, and excellent wear resistance. Diamond wire sawing is an innovative technology applied in the stone cutting industry, significantly reducing processing noise and kerf width, minimizing material cutting loss, and lowering dust pollution, thereby promoting the green development of the industry. This study conducted both single-factor and orthogonal experiments on the diamond wire sawing of marble to investigate the influences of workpiece feed speed, diamond wire speed, and cut workpiece length on cutting force, surface roughness, and waviness. The results showed that as the workpiece feed speed and cut workpiece length increased, diamond wire speed decreased; the cutting force increased; and the size and number of brittle pits and cracks on the cut surface increased, leading to a gradual increase in surface roughness and waviness. The influence of each factor on cutting force, roughness, and waviness ranked from the largest to the smallest as follows: workpiece feed speed, cut workpiece length and diamond wire speed. The findings provide experimental evidence for understanding the diamond wire sawing process of marble.
The full text can be downloaded at https://doi.org/10.1007/s40436-025-00581-w
Fan Cui
,
Yu-Fei Gao
,
Da-Meng Cheng
,
Hong-Hao Li
. Properties of cutting force, surface roughness and waviness in diamond wire sawing marble[J]. Advances in Manufacturing, 2026
, 14(3)
: 674
-696
.
DOI: 10.1007/s40436-025-00581-w
[1] Rosso F, Pisello AL, Cotana F et al (2014) Integrated thermal-energy analysis of innovative translucent white marble for building envelope application. Sustainability 6:5439-5462. https://doi.org/10.3390/su6085439
[2] Bani BM (2017) The application of marble and granite as building materials in Jordan. Jordan J Civ Eng 11:234-238
[3] Sun D, Zhang J, Sun T et al (2022) Microscale formation mechanism of surface morphology and chips features of granitic rocks considering different machining parameters. Int J Adv Manuf Technol 121:2399-2413. https://doi.org/10.1007/s00170-022-09347-1
[4] Dong P, Zhang J, Wu J et al (2021) Performance investigation of traditional diamond frame saw in processing granite. Int J Refract Met Hard Mater 99:105601. https://doi.org/10.1016/j.ijrmhm.2021.105601
[5] Bayram F, Kulaksiz S (2021) Evaluation of rock cutting performance of diamond segmented frame saw in terms of diamond segment wear. Int J Rock Mech Min Sci 139:104657. https://doi.org/10.1016/j.ijrmms.2021.104657
[6] Zhou J, Wang K, Zhang J et al (2022) Rock breakage and tools performance during rock processing by multidiameter combination saw with different diameters. Rock Mech Rock Eng 55:4459-4476. https://doi.org/10.1007/s00603-022-02824-9
[7] Tian Y, Sang Y, Liu J (2022) A numerical model for rock cutting with diamond circular saw blade based on smoothed particle galerkin method. Math Probl Eng 2022:2036301. https://doi.org/10.1155/2022/2036301
[8] Zhang ZM, Xiao HW, Wang GZ et al (2013) Modeling and experimental study on cutting force of diamond circular saw in cutting granite using response surface methodology. Adv Mater Res 652/654:2191-2195. https://doi.org/10.4028/www.scientific.net/AMR.652-654.2191
[9] Buyuksagis IS, Rostami J, Yagiz S (2020) Development of models for estimating specific energy and specific wear rate of circular diamond saw blades based on properties of carbonate rocks. Int J Rock Mech Min Sci 135:104497. https://doi.org/10.1016/j.ijrmms.2020.104497
[10] Wang Z, Zeng Q, Wan L et al (2022) Investigation of fragment separation during a circular saw blade cutting rock based on ANSYS/LS-DYNA. Sci Rep 12:17346. https://doi.org/10.1038/s41598-022-22267-0
[11] Konstanty JS (2021) The mechanics of sawing granite with diamond wire. Int J Adv Manuf Technol 116:2591-2597. https://doi.org/10.1007/s00170-021-07577-3
[12] Rasti A, Adarmanabadi HR, Sahlabadi MR (2021) Effects of controllable and uncontrollable parameters on diamond wire cutting performance using statistical analysis: a case study. Rud-Geol-Naft Zb 36:21-32. https://doi.org/10.17794/rgn.2021.4.3
[13] Najmedin AS, Bagherpour R, Mikaeil R et al (2017) Analysis of bead wear in diamond wire sawing considering the rock properties and production rate. Bull Eng Geol Environ 76:1593-1607. https://doi.org/10.1007/s10064-017-1057-9
[14] Polat C, Tumac D (2024) Field and laboratory studies guiding to empirical prediction of cutting and bead consumption rates of diamond wire cutting machines. Bull Eng Geol Environ 83:486. https://doi.org/10.1007/s10064-024-03945-x
[15] Amirsharafi A, Noroozi M, Sereshki F (2023) Investigation of cutting rate of diamond wire saw machine using numerical modeling. Rock Mech Rock Eng 56:7301-7314. https://doi.org/10.1007/s00603-023-03352-w
[16] Nayak SK, Satapathy A, Mantry S (2022) Use of waste marble and granite dust in structural applications: a review. J Build Eng 46:103742. https://doi.org/10.1016/j.jobe.2021.103742
[17] Bilgin N, Yeprem HA, Arslan S et al (2012) Use of waste marble powder in brick industry. Constr Build Mater 29:449-457. https://doi.org/10.1016/j.conbuildmat.2011.10.011
[18] Liu Y, Wang J, Chen C et al (2011) Experimental study on ring diamond wire cutting of marble. Eng Superhard Mater 23:1-4
[19] Chen C, Qin J, Lin F (2015) Application and development of wafer dicing technology. Superabrasives Eng 27:12-16
[20] Zhong C, Jiang X (2006) High-speed and high-precision cutting and processing of natural marble with diamond wire saws. Superabrasives Eng 6:42-47
[21] Yilmazkaya E, Ozcelik Y (2016) The effects of operational parameters on a mono-wire cutting system: efficiency in marble processing. Rock Mech Rock Eng 49:523-539. https://doi.org/10.1007/s00603-015-0743-9
[22] Liu T, Zhang P, Su Y et al (2024) Fractal analysis on the surface topography of monocrystalline silicon wafers sawn by diamond wire. Mater Sci Semicond Process 180:108588. https://doi.org/10.1016/j.mssp.2024.108588
[23] Costa EC, Weingaertner WL, Xavier FA (2022) Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth. Mater Sci Semicond Process 143:106525. https://doi.org/10.1016/j.mssp.2022.106525
[24] Li SJ, Tang AF, Liu Y et al (2016) Analytical force modeling of fixed abrasive diamond wire saw machining with application to SiC monocrystal wafer processing. J Manuf Sci Eng 139(4):041003. https://doi.org/10.1115/1.4034792
[25] Qiu J, Wang Z, Liu C et al (2022) Investigation on the equipment and tool influencing factors on machining performance of endless diamond wire sawing. Int J Adv Manuf Technol 121:6341-6359. https://doi.org/10.1007/s00170-022-09705-z
[26] Würzner S, Falke A, Buchwald R et al (2015) Determination of the impact of the wire velocity on the surface damage of diamond wire sawn silicon wafers. Energy Procedia 77:881-890. https://doi.org/10.1016/j.egypro.2015.07.124
[27] Gao P, Tan B, Yang F et al (2021) Influence of diamond wire saw slicing parameters on (010) lattice plane beta-gallium oxide single crystal wafer. Mater Sci Semicond Process 133:105939. https://doi.org/10.1016/j.mssp.2021.105939
[28] Tang AF, Li SJ, Yang GG et al (2019) Wire vibration modeling and experimental analysis for wire saw machining. J Manuf Sci Eng 141(12):121003. https://doi.org/10.1115/1.4045059
[29] Lai Z, Liao X, Yang H et al (2024) Experimental study on the formation mechanism of saw marks in wire sawing. Int J Mech Sci 265:108894. https://doi.org/10.1016/j.ijmecsci.2023.108894
[30] Qiu J, Liu C, Zhang S (2021) The machining accuracy and surface roughness of mono-crystalline silicon regarding wire lag and wire stiffness of endless diamond wire. Int J Adv Manuf Technol 117:3253-3265. https://doi.org/10.1007/s00170-021-07908-4
[31] Liu J, Zhang Z, Wan S et al (2022) Experimental and theoretical investigations on diamond wire sawing for a NdFeB magnet. Materials 15:3034. https://doi.org/10.3390/ma15093034
[32] Jung IY, Song S, Choi M et al (2019) Evolution of mechanically formed bow due to surface waviness and residual stress difference on sapphire (0001) substrate. J Mater Process Technol 269:102-108. https://doi.org/10.1016/j.jmatprotec.2019.02.003
[33] Sekhar H, Fukuda T, Tanahashi K et al (2018) The impact of saw mark direction on the fracture strength of thin (120 μm) monocrystalline silicon wafers for photovoltaic cells. Jpn J Appl Phys 57:095501. https://doi.org/10.7567/JJAP.57.095501
[34] Zhu Z, Gao Y (2023) Study on surface roughness and morphology of diamond wire as-sawn sapphire crystal wafers. Int J Adv Manuf Technol 125:2077-2090. https://doi.org/10.1007/s00170-023-10830-6
[35] Zhang S, Gao Y, Zhang X et al (2023) Influence of diamond wire saw processing parameters on the sawn surface characteristics of silicon nitride ceramics. Micromachines 14:1660. https://doi.org/10.3390/mi14091660
[36] Zhang X, Gao Y, Yang C et al (2024) Surface characteristics of precision as-cut NdFeB magnet considering diamond wire wear. Precis Eng 89:23-36. https://doi.org/10.1016/j.precisioneng.2024.06.004
[37] National Product Size and Geometric Technical Specification Standardization Technical Committee (2009) Geometrical productspecifications(GPS) — surface texture: profile method — surfacewavinessterms. Standards Press of China, Beijing
[38] Ji Z, Shi H, Dai X et al (2021) Fragmentation characteristics of rocks under indentation by a single polycrystalline diamond compact cutter. J Energy Resour Technol 143(10):100903. https://doi.org/10.1115/1.4050340
[39] Sun P, Wei C, Zhang H et al (2024) Study on the effect of diamond wire saw-cutting process parameters on brittle cracks in monocrystalline silicon. Appl Phys A 130:754. https://doi.org/10.1007/s00339-024-07919-4
[40] Liu L, Li Y, Li T et al (2025) Wave velocities and anisotropy of rocks: Implication for origin of low velocity zone of the qinling orogenic belt. China. Geosci Front 16:101939. https://doi.org/10.1016/j.gsf.2024.101939
[41] Yin Y, Gao Y, Li X et al (2020) Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw. Mater Sci Semicond Process 106:104779. https://doi.org/10.1016/j.mssp.2019.104779
