Analysis and simulation of high-power LED array with microchannel heat sink

doi:10.1007/s40436-013-0027-0

Advances in Manufacturing

• • 上一篇

Analysis and simulation of high-power LED array with microchannel heat sink

Xin Zhang • Ru-Chun Li • Qi Zheng

College of Information Engineering, Zhejiang University of Technology, Hangzhou 310023, People’s Republic of China

收稿日期:2013-01-28 修回日期:2013-04-25 出版日期:2013-06-25 发布日期:2013-05-13

Analysis and simulation of high-power LED array with microchannel heat sink

Xin Zhang • Ru-Chun Li • Qi Zheng

College of Information Engineering, Zhejiang University of Technology, Hangzhou 310023, People’s Republic of China

Received:2013-01-28 Revised:2013-04-25 Online:2013-06-25 Published:2013-05-13

摘要/Abstract

摘要： The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resistance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis.
Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resistance is 0.019 W/℃.

关键词: High-power LED array , Microchannel heat sink , Thermal resistance , Analytical solution, Optimized simulation

Abstract: The high power light emitting diode (LED) array integrated with the microchannel heat sink is designed in this paper, and then optimal analysis and simulation have been carried out. According to the theory of heat transfer and fluid mechanics, the calculation of the thermal resistance for the microchannel heat sink is obtained, and the thermal resistance is minimized. Finally the simulation with FLUENT software is developed to verify the theoretical analysis.
Established analysis and simulation show that the width of the cooling channel is 0.1 mm, and the cooling water flow rate is 1 m/s. On the other hand, the system acquires the best heat dissipation effect, and the minimum of thermal resistance is 0.019 W/℃.

Key words: High-power LED array , Microchannel heat sink , Thermal resistance , Analytical solution, Optimized simulation

Xin Zhang, Ru-Chun Li, Qi Zheng. Analysis and simulation of high-power LED array with microchannel heat sink[J]. Advances in Manufacturing, doi: 10.1007/s40436-013-0027-0.

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Analysis and simulation of high-power LED array with microchannel heat sink

Analysis and simulation of high-power LED array with microchannel heat sink

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