Advances in Manufacturing ›› 2025, Vol. 13 ›› Issue (2): 413-429.doi: 10.1007/s40436-024-00510-3

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Structural design and simulation of PDMS/SiC functionally graded substrates for applications in flexible hybrid electronics

Jian-Jun Yang1,2, Yin-Bao Song1,2, Zheng-Hao Li1,2, Luo-Wei Wang1,2, Shuai Shang1,2, Hong-Ke Li1,2, Hou-Chao Zhang1,2, Rui Wang1,2, Hong-Bo Lan1,2, Xiao-Yang Zhu1,2   

  1. 1. Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, Shandong, People's Republic of China;
    2. Key Laboratory of Additive Manufacturing and Applications in Universities of Shandong, Qingdao University of Technology, Qingdao 266520, Shandong, People's Republic of China
  • 收稿日期:2023-09-20 修回日期:2024-01-20 发布日期:2025-05-16
  • 通讯作者: Zheng-Hao Li,E-mail:lizhenghaowork@126.com;Hong-Bo Lan,E-mail:hblan99@126.com;Xiao-Yang Zhu,E-mail:zhuxiaoyang@qut.edu.cn E-mail:lizhenghaowork@126.com;hblan99@126.com;zhuxiaoyang@qut.edu.cn
  • 作者简介:Jian-Jun Yang is a professor of Shandong Engineering Research Center for Additive Manufacturing at Qingdao University of Technology. His research interests are micro-scale 3D printing, flexible electronics, composite materials/functional gradient 3D printing, and system engineering optimization. He has completed and presided over more than 10 national and provincial research projects, published more than 50 papers, and included more than 30 papers in SCI/EI.
    Yin-Bao Song obtained his Master degree in Mechanical Engineering from Qingdao University of Technology in 2022. His research interests focus on micro-nano additive manufacturing, and composite materials/ functional gradient 3D printing. Zheng-Hao Li is a Ph.D. candidate at Qingdao University of Technology, and obtained his Master degree in Mechanical Engineering in 2021 from Qingdao University of Technology. His research includes 4D printingflexible transparent electrode, 3D printing of multilayered and multimaterial electronics.
    Luo-Wei Wang is a master degree candidate of the Qingdao University of Technology. His research interests focus on micro-nano additive manufacturing, and composite materials/ functional gradient 3D printing.
    Shuai Shang is a master degree candidate of the Qingdao University of Technology. Her research interests focus on micro-nano additive manufacturing, micro-transfer technologies, and multi-scale and multi-material 3D printing.
    Hong-Ke Li received his master degree in Mechanical Engineering from Qingdao University of Technology in 2020. He is currently a Ph.D. candidate at Qingdao University of Technology. His research focuses on 3D printing and micro-nano additive manufacturing, as well as exploring its integrated printing and application in transparent elect rodes, flexiblehy brid electronics.
    Hou-Chao Zhang is a Ph.D. candidate at Qingdao University of Technology, and obtained his Master degree in Mechanical Engineering in 2021 from Qingdao University of Technology. His research mainly includes composite micro/nano additive manufacturing technology, EFD micro-scale 3D printing technology, and high-performance electrode fabrication.
    Rui Wang is a master degree candidate of the Qingdao University of Technology. Her research interests focus on 3D printing and micro-nano additive manufacturing, as well as exploring its fabrication and applications in the field of flexible strain sensors and wearable devices.
    Hong-Bo Lan is a professor and a director in Shandong Engineering Research Center for Additive Manufacturing, Qindao Engineering Research Center for 3D Printing, Qingdao University of Technology. His research interests include micro/nano-scale 3D printing, additive manufacturing advanced circuits and electronics, large-area nanoimprint lithography, additive manufacturing. He is the author and coauthor of 1 book, 6 book chapters, over 150 scientific papers in journals and conferences. He held 52 China granted patents, 3 U.S granted patents and 1 German granted patent. He was elected as national outstanding middle-aged and young expert, received special government allowances of the State Council.
    Xiao-Yang Zhu is a associate professor of Shandong Engineering Research Center for Additive Manufacturing at Qingdao University of Technology. He received his Ph.D. degree from Nanjing University of Science and Technology in 2016. His research interests are micro-scale 3D printing, multi-scale and multi-material 3D printing, transparent electronics, flexible electronics, conformal electronics, and multilayer electronics. He has published more than 50 SCI/EI.
  • 基金资助:
    This study was supported by National Natural Science Foundation of China (Grant No. 52175331), the Natural Science Foundation of Shandong Province, China (Granted Nos. ZR2021ME139, ZR2022ME014, and ZR2020ZD04).

Structural design and simulation of PDMS/SiC functionally graded substrates for applications in flexible hybrid electronics

Jian-Jun Yang1,2, Yin-Bao Song1,2, Zheng-Hao Li1,2, Luo-Wei Wang1,2, Shuai Shang1,2, Hong-Ke Li1,2, Hou-Chao Zhang1,2, Rui Wang1,2, Hong-Bo Lan1,2, Xiao-Yang Zhu1,2   

  1. 1. Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao 266520, Shandong, People's Republic of China;
    2. Key Laboratory of Additive Manufacturing and Applications in Universities of Shandong, Qingdao University of Technology, Qingdao 266520, Shandong, People's Republic of China
  • Received:2023-09-20 Revised:2024-01-20 Published:2025-05-16
  • Contact: Zheng-Hao Li,E-mail:lizhenghaowork@126.com;Hong-Bo Lan,E-mail:hblan99@126.com;Xiao-Yang Zhu,E-mail:zhuxiaoyang@qut.edu.cn E-mail:lizhenghaowork@126.com;hblan99@126.com;zhuxiaoyang@qut.edu.cn
  • Supported by:
    This study was supported by National Natural Science Foundation of China (Grant No. 52175331), the Natural Science Foundation of Shandong Province, China (Granted Nos. ZR2021ME139, ZR2022ME014, and ZR2020ZD04).

摘要: Flexible hybrid electronics possess significant potential for applications in biomedical and wearable devices due to their advantageous properties of good ductility, low mass, and portability. However, they often exhibit a substantial disparity in elastic modulus between the flexible substrate and rigid components. This discrepancy can result in damage to the rigid components themselves and detachment from the substrate when subjected to tensile, bending, or other loads. Consequently, it diminishes the lifespan of flexible hybrid electronics and restricts their broader-scale application. Therefore, this paper proposes a polydimethylsiloxane (PDMS)/SiC functionally graded flexible substrate based on variable stiffness properties. Initially, ABAQUS simulation is employed to analyze how variations in stiffness impact the stress-strain behavior of PDMS/SiC functionally graded flexible substrates. Subsequently, we propose a multi-material 3D printing process for fabricating PDMS/SiC functionally graded flexible substrates and develop an advanced multi-material 3D printing equipment to facilitate this process. Tensile specimens with the functional gradient of PDMS/SiC are successfully fabricated and subjected to mechanical testing. The results from the tensile tests demonstrate a significant enhancement in the tensile rate (from 21.6% to 35%) when utilizing the PDMS/SiC functionally graded flexible substrate compared to those employing only PDMS substrate. Furthermore, the application of PDMS/SiC functional gradient flexible substrate exhibits remarkable bending and tensile properties in stretchable electronics and skin electronics domains. The integrated fabrication approach of the PDMS/SiC functionally graded flexible substrate structure presents a novel high-performance solution along with its corresponding 3D printing methodology for stretchable flexible electronics, skin electronics, and other related fields.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-024-00510-3

关键词: Multi-material 3D printing, PDMS/SiC, Functionally graded flexible substrate, Structural design and simulation

Abstract: Flexible hybrid electronics possess significant potential for applications in biomedical and wearable devices due to their advantageous properties of good ductility, low mass, and portability. However, they often exhibit a substantial disparity in elastic modulus between the flexible substrate and rigid components. This discrepancy can result in damage to the rigid components themselves and detachment from the substrate when subjected to tensile, bending, or other loads. Consequently, it diminishes the lifespan of flexible hybrid electronics and restricts their broader-scale application. Therefore, this paper proposes a polydimethylsiloxane (PDMS)/SiC functionally graded flexible substrate based on variable stiffness properties. Initially, ABAQUS simulation is employed to analyze how variations in stiffness impact the stress-strain behavior of PDMS/SiC functionally graded flexible substrates. Subsequently, we propose a multi-material 3D printing process for fabricating PDMS/SiC functionally graded flexible substrates and develop an advanced multi-material 3D printing equipment to facilitate this process. Tensile specimens with the functional gradient of PDMS/SiC are successfully fabricated and subjected to mechanical testing. The results from the tensile tests demonstrate a significant enhancement in the tensile rate (from 21.6% to 35%) when utilizing the PDMS/SiC functionally graded flexible substrate compared to those employing only PDMS substrate. Furthermore, the application of PDMS/SiC functional gradient flexible substrate exhibits remarkable bending and tensile properties in stretchable electronics and skin electronics domains. The integrated fabrication approach of the PDMS/SiC functionally graded flexible substrate structure presents a novel high-performance solution along with its corresponding 3D printing methodology for stretchable flexible electronics, skin electronics, and other related fields.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-024-00510-3

Key words: Multi-material 3D printing, PDMS/SiC, Functionally graded flexible substrate, Structural design and simulation