Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

doi:10.1007/s40436-022-00421-1

Advances in Manufacturing ›› 2023, Vol. 11 ›› Issue (2): 212-221.doi: 10.1007/s40436-022-00421-1

• ARTICLES • 上一篇

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Xi Lu¹, Jin-Ming He¹, Ya-Dong Xu¹, Jian-Hong Wei¹, Jian-Hui Li², Hao-Hui Long², You-Gen Hu¹, Rong Sun¹

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, Guangdong, People's Republic of China;
2. Huawei Device (Dongguan) Company Ltd., Dongguan, 523000, Guangdong, People's Republic of China

收稿日期:2022-05-19 修回日期:2022-07-23 发布日期:2023-05-20
通讯作者: Jian-Hui Li,E-mail:lijianhui@huawei.com;You-Gen Hu,E-mail:yg.hu@siat.ac.cn E-mail:lijianhui@huawei.com;yg.hu@siat.ac.cn
作者简介:Xi Lu received his Ph.D. from The Hong Kong Polytechnic University in 2019. He works currently as an Assistant Researcher at the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. His current research interests are micro-nano fabrication technologies and EMI shielding materials.
Jin?Ming He received his M. Eng. from Xiangtan University in 2017. In 2020, he joined the Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences as a material engineer. His current research interests include electronic EMI shielding materials and their applications.
Ya?Dong Xu received his Ph.D. from North University of China in 2019. In 2019, he joined the Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences as an Assistant Researcher. His current research interests include high performance EMI shielding materials and conductive polymer composites in advanced electronic packaging.
Jian?Hong Wei received his bachelor degree from Beihang University in 2020. Currently, he is a graduate student under the supervision of Prof. Rong Sun and Dr. You-Gen Hu, at the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. His research focuses on polymer-based EMI shielding materials.
Jian?Hui Li received the Ph.D. degree from the Huazhong University of Science and Technology, Wuhan, China, in 2009. He is currently a Project Manager with Huawei Device Co., Ltd., Dongguan, China.
Hao?Hui Long (Senior Member, IEEE) received the Ph.D. degree from the National University of Singapore (NUS), Singapore, in 2002. He is currently the Head of Design for Reliability Department of Huawei Device Co., Ltd., Dongguan, China.
You?Gen Hu received his Ph.D. from University of Chinese Academy of Sciences in 2017. In 2010, he joined the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences and became an Associate Professor in 2018. His current research interests include electronic packaging materials, conductive polymer composites, EMI shielding materials, fexible electronic materials and their applications. He serves as the Youth Editorial Board Member of Soft Science.
Rong Sun received her Ph.D. from the Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences in 2006. She is currently the Director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. Her research interests include fip-chip underfll, through silicon via, thermal interface materials, embedded capacitor inductor resistance, and EMI shielding materials.
基金资助:
The authors are grateful for the financial support from the National Natural Science Foundation of China (Grant No. 62074154), Shenzhen Science and Technology Program (Grant Nos. JSGG20210802153000002, JCYJ20210324102208023).

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Xi Lu¹, Jin-Ming He¹, Ya-Dong Xu¹, Jian-Hong Wei¹, Jian-Hui Li², Hao-Hui Long², You-Gen Hu¹, Rong Sun¹

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, Guangdong, People's Republic of China;
2. Huawei Device (Dongguan) Company Ltd., Dongguan, 523000, Guangdong, People's Republic of China

Received:2022-05-19 Revised:2022-07-23 Published:2023-05-20
Contact: Jian-Hui Li,E-mail:lijianhui@huawei.com;You-Gen Hu,E-mail:yg.hu@siat.ac.cn E-mail:lijianhui@huawei.com;yg.hu@siat.ac.cn
Supported by:
The authors are grateful for the financial support from the National Natural Science Foundation of China (Grant No. 62074154), Shenzhen Science and Technology Program (Grant Nos. JSGG20210802153000002, JCYJ20210324102208023).

摘要/Abstract

摘要： Conductive adhesive tape is one kind of electromagnetic interference (EMI) shielding materials for electronic packaging. However, the inferior conductivity of the pressure-sensitive adhesive (PSA) layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects. Adding conductive fillers is a traditional method for highly conductive adhesive tapes. However, the content of conductive fillers is needed to reach the percolation threshold, which is usually as high as tens of percent. High-content fillers result in significant loss of adhesive property and high fabrication cost. Herein, we introduce a rational architecture of conductive microsphere monolayer (CMM) in the PSA layer. The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction. Importantly, low contents of conductive microspheres (≤5 % (mass fraction, w)) can achieve the target of conductivity improvement, but not result in the serious loss of the adhesive property. Therefore, the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes. Finally, we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes, indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00421-1

关键词: Microsphere monolayer, Pressure-sensitive adhesive (PSA), Conductive tapes, Electronic packaging, Electromagnetic interference (EMI) shielding

Abstract: Conductive adhesive tape is one kind of electromagnetic interference (EMI) shielding materials for electronic packaging. However, the inferior conductivity of the pressure-sensitive adhesive (PSA) layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects. Adding conductive fillers is a traditional method for highly conductive adhesive tapes. However, the content of conductive fillers is needed to reach the percolation threshold, which is usually as high as tens of percent. High-content fillers result in significant loss of adhesive property and high fabrication cost. Herein, we introduce a rational architecture of conductive microsphere monolayer (CMM) in the PSA layer. The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction. Importantly, low contents of conductive microspheres (≤5 % (mass fraction, w)) can achieve the target of conductivity improvement, but not result in the serious loss of the adhesive property. Therefore, the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes. Finally, we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes, indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00421-1

Key words: Microsphere monolayer, Pressure-sensitive adhesive (PSA), Conductive tapes, Electronic packaging, Electromagnetic interference (EMI) shielding

Xi Lu, Jin-Ming He, Ya-Dong Xu, Jian-Hong Wei, Jian-Hui Li, Hao-Hui Long, You-Gen Hu, Rong Sun. Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding[J]. Advances in Manufacturing, 2023, 11(2): 212-221.

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Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

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