Advances in Manufacturing

Global optimization of process parameters for low-temperature SiN_x based on orthogonal experiments

Lian-Qiao Yang, Chi Zhang, Wen-Lei Li, Guo-He Liu, Majiaqi Wu, Jin-Qiang Liu, Jian-Hua Zhang

2023, 11(2): 181-190. doi:10.1007/s40436-022-00423-z

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Low-temperature silicon nitride (SiN_x) films deposited by plasma-enhanced chemical vapor deposition (PECVD) have huge application potential in the flexible display. However, the applicability of SiN_x largely depends on the film’s general properties, including flexibility, deposition rate, residual stress, elastic modulus, fracture strain, dielectric constant, refraction index, etc. Process optimization towards specific application by conventional experiment design needs lots of work due to the interaction of muti quality and process parameters. Therefore, an efficient global optimization approach for the process technology was proposed based on the Taguchi orthogonal experiment method considering muti-factor muti-responses. First of all, the Taguchi orthogonal experiment design and analysis was used to rank the influences of main process parameters on the quality characteristics, including radio frequency (RF) power, pressure, silane flow rate, ammonia flow rate and nitrogen flow rate. Then, the global optimization approach was carried out utilizing the multi-response optimizer considering the combination target of film formation rate, residual stress, dielectric constant, elastic modulus, fracture strain, refractive index. Finally, the optimal solution of the SiN_x film was finally obtained and verified.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00423-z

Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID)

Hao-Hui Long, Hui-Cai Ma, Jia-Ying Gao, Li Zhang, De-Ming Zhang, Jian-Qiu Chen

2023, 11(2): 191-202. doi:10.1007/s40436-022-00420-2

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In this paper, the system on display panel (SoDP) architecture, the primary stage of heterogeneous integration system in display (HiSID), is introduced for the first time. In this architecture, the driving components of display, which are supposed to be on the display flexible print circuit (FPC) in traditional architecture, are innovatively integrated onto the backside of display panel. Through the SoDP architecture, the simulated impact strain in the panel fan-out region can decrease about 30% compared to the traditional architecture, and SoDP provides more the 10 mm extra space in the in-plane Y-direction for holding a larger battery. Also, the SoDP is compatible with the current organic laser emitted diode (OLED) and system in package (SiP) processes. Besides the primary stage, this paper also presents a comprehensive and extensive analysis on the challenges of the manufacturability for the advanced stage of HiSID from four key technologies perspectives: device miniaturization, massive manufacturing, driving technology, and advanced heterogeneous integration.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00420-2

Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications

Wen-Hui Zhu, Xiao-Yu Xiao, Zhuo Chen, Gui Chen, Ya-Mei Yan, Lian-Cheng Wang, Gang-Long Li

2023, 11(2): 203-211. doi:10.1007/s40436-022-00419-9

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An urgent demand for lowering bonding temperature has been put forward by advanced flip-chip integration such as micro-LED packaging and heterogeneous integration of semiconductor devices. Indium microbump with low-melting point has attracted attention for its potential use as the interconnection intermediate, and the development of its fabrication process is therefore of great attraction. To reveal the critical process factors for successfully fabricating a high-density In microbump array, this paper investigated a simple process flow of In patterning and reflow and detailed the flux-assisted wet reflow process. Critical process conditions, including the patterned In volume, alignment accuracy, reflow reagent liquidity, and temperature profile, were described, with a particular emphasis on the role of surface tension of molten indium film during the formation of spherical microbumps. A high-density indium ball array with an overall yield greater than 99.7% can be obtained, which suggests that the In patterning and wet-reflow processes are robust and that a high-quality microbump array could be readily formed with low equipment requirements. Furthermore, the interfacial reaction characteristics between In microbump and Au adhesion layer were investigated under thermal aging conditions, which revealed lateral intermetallic growth of AuIn₂ compound and well-retained interfacial strength even after prolonged aging.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00419-9

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Xi Lu, Jin-Ming He, Ya-Dong Xu, Jian-Hong Wei, Jian-Hui Li, Hao-Hui Long, You-Gen Hu, Rong Sun

2023, 11(2): 212-221. doi:10.1007/s40436-022-00421-1

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Conductive adhesive tape is one kind of electromagnetic interference (EMI) shielding materials for electronic packaging. However, the inferior conductivity of the pressure-sensitive adhesive (PSA) layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects. Adding conductive fillers is a traditional method for highly conductive adhesive tapes. However, the content of conductive fillers is needed to reach the percolation threshold, which is usually as high as tens of percent. High-content fillers result in significant loss of adhesive property and high fabrication cost. Herein, we introduce a rational architecture of conductive microsphere monolayer (CMM) in the PSA layer. The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction. Importantly, low contents of conductive microspheres (≤5 % (mass fraction, w)) can achieve the target of conductivity improvement, but not result in the serious loss of the adhesive property. Therefore, the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes. Finally, we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes, indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00421-1

Optimal tool design in micro-milling of difficult-to-machine materials

Lorcan O'Toole, Feng-Zhou Fang

2023, 11(2): 222-247. doi:10.1007/s40436-022-00418-w

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The limitations of significant tool wear and tool breakage of commercially available fluted micro-end mill tools often lead to ineffective and inefficient manufacturing, while surface quality and geometric dimensions remain unacceptably poor. This is especially true for machining of difficult-to-machine (DTM) materials, such as super alloys and ceramics. Such conventional fluted micro-tool designs are generally down scaled from the macro-milling tool designs. However, simply scaling such designs from the macro to micro domain leads to inherent design flaws, such as poor tool rigidity, poor tool strength and weak cutting edges, ultimately ending in tool failure. Therefore, in this article a design process is first established to determine optimal micro-end mill tool designs for machining some typical DTM materials commonly used in manufacturing orthopaedic implants and micro-feature moulds. The design process focuses on achieving robust stiffness and mechanical strength to reduce tool wear, avoid tool chipping and tool breakage in order to efficiently machine very hard materials. Then, static stress and deflection finite element analysis (FEA) is carried out to identify stiffness and rigidity of the tool design in relation to the maximum deformations, as well as the Von Mises stress distribution at the cutting edge of the designed tools. Following analysis and further optimisation of the FEA results, a verified optimum tool design is established for micro-milling DTM materials. An experimental study is then carried out to compare the optimum tool design to commercial tools, in regards to cutting forces, tool wear and surface quality.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00418-w

Application of sensor data based predictive maintenance and artificial neural networks to enable Industry 4.0

Jon Martin Fordal, Per Schj?lberg, Hallvard Helgetun, Tor ?istein Skjermo, Yi Wang, Chen Wang

2023, 11(2): 248-263. doi:10.1007/s40436-022-00433-x

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Possessing an efficient production line relies heavily on the availability of the production equipment. Thus, to ensure that the required function for critical equipment is in compliance, and unplanned downtime is minimized, succeeding with the field of maintenance is essential for industrialists. With the emergence of advanced manufacturing processes, incorporating predictive maintenance capabilities is seen as a necessity. Another field of interest is how modern value chains can support the maintenance function in a company. Accessibility to data from processes, equipment and products have increased significantly with the introduction of sensors and Industry 4.0 technologies. However, how to gather and utilize these data for enabling improved decision making within maintenance and value chain is still a challenge. Thus, the aim of this paper is to investigate on how maintenance and value chain data can collectively be used to improve value chain performance through prediction. The research approach includes both theoretical testing and industrial testing. The paper presents a novel concept for a predictive maintenance platform, and an artificial neural network (ANN) model with sensor data input. Further, a case of a company that has chosen to apply the platform, with the implications and determinants of this decision, is also provided. Results show that the platform can be used as an entry-level solution to enable Industry 4.0 and sensor data based predictive maintenance.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00433-x

Improving the forming performance of incrementally formed sheet parts with customized heat treatment strategies

Hao Yuan, Yan-Le Li, Yuan-Yu Liu, Gang-Lin Zhao, Fang-Yi Li

2023, 11(2): 264-279. doi:10.1007/s40436-022-00431-z

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Although incremental sheet forming (ISF) is an efficient way to manufacture customized parts, the forming performance and geometric accuracy of formed parts need to be improved to meet industrial application. One feasible solution for these problems is to adopt proper heat treatment strategies for the sheet material both before and during the forming process. In this paper, the effects of heat treatment before forming and heat-assisted forming on the formability and performance of formed parts were experimentally investigated. First, TA1 sheets were heat-treated at different temperatures before forming, and then the sheets were incrementally formed into the target shape with variable angles at different temperatures. After heat treatment, the strength of sheets was decreased due to the occurrence of recrystallization and the growth of grains. Meanwhile, the surface quality of formed parts was also improved with pre-heat treatment before forming. During the heat-assisted forming process, the sheet was softened and the deformation resistance was reduced with the increase of temperature. Therefore, the axial forming force was decreased obviously and the formability of the sheet was increased obviously. Furthermore, by adopting both heat treatment and heat-assisted forming, it was found that the forming force could be further reduced and the formability of the sheet and surface quality could be further improved. As for geometric accuracy, heat treatment has a good effect on improving it, while heat-assisted forming has adverse effect. These findings provide an effective heat treatment strategy for improving the geometric accuracy and surface quality of the incrementally formed parts with lower forming force.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00431-z

A novel predict-prevention quality control method of multi-stage manufacturing process towards zero defect manufacturing

Li-Ping Zhao, Bo-Hao Li, Yi-Yong Yao

2023, 11(2): 280-294. doi:10.1007/s40436-022-00427-9

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Zero defection manufacturing (ZDM) is the pursuit of the manufacturing industry. However, there is a lack of the implementation method of ZDM in the multi-stage manufacturing process (MMP). Implementing ZDM and controlling product quality in MMP remains an urgent problem in intelligent manufacturing. A novel predict-prevention quality control method in MMP towards ZDM is proposed, including quality characteristics monitoring, key quality characteristics prediction, and assembly quality optimization. The stability of the quality characteristics is detected by analyzing the distribution of quality characteristics. By considering the correlations between different quality characteristics, a deep supervised long-short term memory (SLSTM) prediction network is built for time series prediction of quality characteristics. A long-short term memory-genetic algorithm (LSTM-GA) network is proposed to optimize the assembly quality. By utilizing the proposed quality control method in MMP, unqualified products can be avoided, and ZDM of MMP is implemented. Extensive empirical evaluations on the MMP of compressors validate the applicability and practicability of the proposed method.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00427-9

Novel gripper module and method for automated assembly of miniature parts

Zhi-Yong Zhang, Xiao-Dong Wang, Tong-Qun Ren, Tian-Lun Jin

2023, 11(2): 295-310. doi:10.1007/s40436-022-00425-x

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During assembly process, the miniature part needs to be fixed in its assembly position. In some occasions where adhesive is used, the joining force is not established due to the adhesive curing process, in that case the locking of parts is required. Manual locking is difficult to meet the increasing demand for mass production. To solve this problem and realize fully automatic assembly, a novel gripper module was designed and corresponding locking method was proposed. Thanks to the functional integration, the gripper module is capable of manipulating and locking the part. This module is integrated into the assembly system and plays a crucial role in automatic assembly. The locking method for automatic assembly is based on the integration of the part picking up and the locking unit releasing. After being placed accurately at its desired position, the miniature part can be automatically locked by releasing the locking unit. The innovative structure and mechanism of the gripper module convert the spring force into the locking force of the miniature part, ensuring non-rigid locking and suitable small locking force. Locking principle, flexibility and limitations of the proposed method were clarified in detail. Moreover, an effective compensation strategy was used to achieve accurate and stable pickup of the part, which increased the reliability of the assembly process. During automatic locking, the disturbances to the part due to the eccentric load were analyzed. The effectiveness of the gripper module and proposed method was verified by experiment. Experimental results indicated that the modular system integrated with the gripper module could meet the requirements of fully automatic assembly. Manual locking is replaced by automatic locking, and workers are liberated from tedious manual operations. The improvement of automation level enables assembly equipment to be applied to mass production scenarios.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00425-x

Deformation characteristics and inertial effect of complex aluminum alloy sheet part under impact hydroforming: experiments and numerical analysis

Liang-Liang Xia, Shi-Hong Zhang, Yong Xu, Shuai-Feng Chen, Boris B. Khina, Artur I. Pokrovsky

2023, 11(2): 311-328. doi:10.1007/s40436-022-00430-0

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Impact hydroforming (IHF), as a novel sheet metal forming technology with the advantages of high strain rate forming and flexible liquid loading, is highly suitable for efficiently manufacturing aluminum complex-shaped sheet parts. In this paper, deformation characteristics of complex sheet parts under IHF are systematically investigated. The mechanical properties of 2024 aluminum alloy under a wide range of strain rates (10^?3 s^?1–3.3×10³ s^?1) were studied. It indicated that the elongation of 2024 aluminum alloy was improved by 116.01% under strain rates of 3.306?×?10³ s^?1, referring to 10^?3 s^?1. Further, a complex-shaped part with symmetrical and asymmetrical structures was selected. The deformation characteristics of sheet and role of inertial effect under IHF were investigated with well-developed solid–liquid coupling finite element (SLC-FE) model with high accuracy. Differentiating deformation tendency is found for symmetrical structure with notably prior deformation at central zone, showing a “bulging” profile at initial forming stage. Whereas, synchronous deformation is presented for asymmetrical structure with a “flat” profile. Additionally, distinctive inertial effect was observed at different positions change for both symmetrical and asymmetrical structures, in which lower values were resulted at their central regions. Meanwhile, the inertial effect evolved with the impacting speed. Specially, larger difference of inertial effect was observed with increasing impacting speed.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00430-0

Multiconditional machining process quality prediction using deep transfer learning network

Bo-Hao Li, Li-Ping Zhao, Yi-Yong Yao

2023, 11(2): 329-341. doi:10.1007/s40436-022-00415-z

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The quality prediction of machining processes is essential for maintaining process stability and improving component quality. The prediction accuracy of conventional methods relies on a significant amount of process signals under the same operating conditions. However, obtaining sufficient data during the machining process is difficult under most operating conditions, and conventional prediction methods require a certain amount of training data. Herein, a new multiconditional machining quality prediction model based on a deep transfer learning network is proposed. A process quality prediction model is built under multiple operating conditions. A deep convolutional neural network (CNN) is used to investigate the connections between multidimensional process signals and quality under source operating conditions. Three strategies, namely structure transfer, parameter transfer, and weight transfer, are used to transfer the trained CNN network to the target operating conditions. The machining quality prediction model predicts the machining quality of the target operating conditions using limited data. A multiconditional forging process is designed to validate the effectiveness of the proposed method. Compared with other data-driven methods, the proposed deep transfer learning network offers enhanced performance in terms of prediction accuracy under different conditions.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-022-00415-z

Surface integrity of ball burnished bioresorbable magnesium alloy

G. V. Jagadeesh, Srinivasu Gangi Setti

2023, 11(2): 342-362. doi:10.1007/s40436-021-00387-6

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Magnesium alloys are potential biodegradable and biocompatible implant materials because of their excellent biological properties. Recently, interest in these alloys as a promising alternative for temporary orthopedic implants has grown owing to their desirable biological, mechanical, and physical properties. However, the application of magnesium alloys is hindered by their rapid degradation and low corrosion resistance in physiological fluids, leading to the failure of implants. Thus, the current challenge is to enhance the corrosion resistance and control the degradation rate of magnesium under physiological conditions. The rapid degradation of magnesium alloys can be controlled by improving their surface integrity, such as surface roughness and microhardness. The present study aims to improve the surface integrity of the Mg Ze41A alloy by the ball burnishing technique. The surface roughness improved by 94.90% from 0.941 μm to 0.048 μm with a burnishing force of 50 N, burnishing speed of 1 300 r/min, burnishing feed of 130 mm/min, and three passes. Similarly, the microhardness improved by 50.62% from 75.2 HV to 113.27 HV with a burnishing force of 60 N, burnishing speed of 1 100 r/min, burnishing feed of 100 mm/min, and five passes. The variations in microhardness, which were observed up to 400 μm beneath the surface, exhibited a linear nature. These variations may be attributed to the movement of dislocations, formation of new dislocations, nanocrystal structures, metastable phases and subgrains, and lattice distortion or grain refinement. The surface features obtained from optical images demonstrated the fundamental mechanisms involved in the ball burnishing process. The concept of burnishing maps and zones will assist in the design of the ball burnishing parameters of a material with an equivalent yield strength of 140 MPa. The significant improvement in the surface integrity of the Mg Ze41A alloy by the ball burnishing technique is expected to improve its functional performance.

The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-021-00387-6

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