Local synthesis of carbon nanotubes for direct integration in Simicrosystems – design considerations

  • Knut E. Aasmundtveit Bao Quoc Ta Quoc-Huy Nguyen Tormod B. Haugen Nils Hoivik Einar Halvorsen
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  • IMST - Department of Micro and Nano System Technology,
    HiVe - Vestfold University College, P.O. Box 2243,
    NO-3103 Tonsberg, Norway
Knut E. Aasmundtveit Bao Quoc Ta Quoc-Huy Nguyen Tormod B. Haugen Nils Hoivik Einar Halvorsen

Received date: 2013-07-22

  Online published: 2013-08-26

Abstract

The integration of nanomaterials such as carbon nanotubes (CNTs) into microsystems is highly desirable, in order to make use of the unique nanomaterial properties in real devices. However, the CNT-to-microsystem integration is challenging to implement in a manufacturable, cost-effective industrial process. This paper presents our work towards a process for making complete, integrated CMOS /MEMS systems with integrated CNT. We demonstrate the feasibility of the process, using room-temperature process-ing, low-cost equipment and consumables, and electrical control with automation possibilities. CNTs are directly integrated at the desired positions in the Si microsystem, forming closed Si / CNT / Si circuits. We explore different designs with the aim to obtain uniform and well-defined CNT synthesis conditions, and show that simplified designs can perform comparably to more complex ones. The Si /CNT / Si circuits obtained can show rectifying (Schottky-like) or near-ohmic behavior. Gas sensing possibilities are demonstrated, indicating the possibility of monitoring aging/fermenting of food. Functionalization of CNTs is demon-strated, using thermal evaporation of Sn and Pd, opening for selective and sensitive sensors for various gases and ana-lytes. Detailed microscopic characterization of the obtained CNTs are presented.

Cite this article

Knut E. Aasmundtveit Bao Quoc Ta Quoc-Huy Nguyen Tormod B. Haugen Nils Hoivik Einar Halvorsen . Local synthesis of carbon nanotubes for direct integration in Simicrosystems – design considerations[J]. Advances in Manufacturing, 2013 , 1(3) : 218 -225 . DOI: DOI10.1007/s40436-013-0037-y

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