Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications

Wen-Hui Zhu, Xiao-Yu Xiao, Zhuo Chen, Gui Chen, Ya-Mei Yan, Lian-Cheng Wang, Gang-Long Li

Advances in Manufacturing . 2023, (2): 203 -211 . DOI: 10.1007/s40436-022-00419-9